Apparatus and method for making electrical connectors

ABSTRACT

A method and apparatus for manufacturing an electrical connection unit and connector array is provided. Such arrays may be used to solder together traces from opposed circuit boards, in which the array is fitted between, and soldered to the boards to complete a circuit. The method of manufacturing a connection unit includes providing a first insulative base with one or more contacts or contact groups extending from the first side towards the second side of the base. Solder portions or solder balls may be reflowed to contacts at their termination points. An apparatus and method may provide a solder positioning device or means on top of or adjacent to the first insulative base, so that solder portions or solder balls are placed within cavities in the positioning device, in alignment with apertures of the first insulative base. The connection unit may be heated to reflow and fuse the solder portions to the contact termination, thereby constructing an array.

CROSS REFERENCE TO RELATED APPLICATIONS

This application was filed concurrently with three other relatedapplications: (1) “Apparatus and Methods for Retaining and PlacingElectrical Components”, by Ashman et al., filed Jul. 30, 2002; (2)“Electrical Connector”, by Ashman et al., filed Jul. 30, 2002; (3)“Electrical Connectors and Electrical Components”, by Ashman et al.,filed Jul. 30, 2002.

BACKGROUND OF THE INVENTION

Electrical connectors are provided in many different varieties fornumerous applications. In the computer and microelectronics industry,electrical connectors may be provided in two separate portions designedto mate with each other. There is an incentive in the industry toprovide smaller connectors. Connectors may be employed to electricallyjoin conductive traces from one circuit board to another. Such aconnector may provide a grid or array of connection points on oppositesurfaces. A two-part connector may be electrically mated on a matingsurface and then meshed to conductive traces of the circuit board onopposite mounting surfaces.

Ball grid array connectors typically use solder portions known as“solder balls” on the ends of contact elements. Solder balls may bepositioned and then reflowed upon a contact, thereby providing theconnector with an electrical pathway to a conductive trace or circuitboard. When a solder ball or an array of balls are placed against acircuit board, the solder ball may be heated and reflowed to melt theballs upon the conductive trace, resulting in a secure solderedelectrical connection. Many different types of ball grid arrayconnectors are known.

Many prior art connection devices use a gender specific first partemploying a male contact portion that is designed for mating with afemale receiver which has a different configuration. Thus, the first“male” portion inserts into a cavity or “female” portion, which resultsin a secure electrical connection.

Unfortunately, the use of gender specific connector parts is costly.Distributors and manufacturers employing such connectors must stock andhold inventory for both the male and female parts. This undesirablyincreases the amount of inventory that must be maintained. Furthermore,having both male and female portions sometimes results in confusionregarding which part is needed when orders are placed. This problem maybe compounded when multiple sized arrays are used. For example, ifspecific connector arrays of 100, 200, 400, and 800 contacts are neededin the industry, then a manufacturer usually must have assembly lines,drawings, tooling, part numbers, packaging and the like to correspondwith each and every different sized array that must be manufactured forthe various end users. If gender-specific male and female components areused, the number of separate parts employed is increased by a factor oftwo. The large number of separate parts needed to make each arraycombination is a significant limitation.

Another problem with male/female combination contacts is that in manysuch devices, only one gender portion undergoes displacement. That is,it is common that only one of such a mated pair actually is displacedwhen mating occurs. For connectors to achieve smaller size, the distanceor space within the housing that is available for displacement ofcontacts is sometimes a critical factor. An arrangement that is capableof minimizing the total linear displacement required for contactelements to resilient mate within a connector housing while stillachieving satisfactory electrical conductivity would be highlydesirable.

Some prior art methods and apparatus employ indentations or depressedportions in the insulative base material. During manufacture, solderportions are placed in such indentations for reflow to contacts.However, the use of indentations in an insulative base requiresrelatively precise machining of the insulative base. This sometimesincreases the cost of such components. Furthermore, disturbances orvoids in such a base unit may undesirably weaken the unit. This mayrequire that the base unit having such voids be engineered with an evengreater thickness to provide a comparable strength.

It would be desirable to provide an apparatus and method formanufacturing connector arrays that employs insulative bases havingrelatively flat surfaces. A method or apparatus that provides a means toprovide solder portions upon a flat surface which are fused uponcontacts, would be desirable. A connector array that makes availablenumerous connection sites in a relatively precise geometricalarrangement that uses only small amounts of material would be desirable.Furthermore, a connection device or system that avoids the need to makeand stock excess parts by avoiding the employment of both male andfemale portions in a multi-part connector would be very helpful. Anarray that is modular, and which can be assimilated into large groupsfor larger arrays, or smaller groups for smaller arrays, would also bevery useful.

SUMMARY OF THE INVENTION

A method and apparatus for manufacturing an electrical connection unithaving an array of solder portions along a plane is disclosed. Themethod comprises providing a first insulative base, the first insulativebase having a first side located in a top plane, a second side, and aplurality of apertures extending between the first side and second side.Apertures may be adapted to receive contacts by insertion. The contactseach comprise a first end and a second end, the first end beingpositioned near the top plane of the first side.

A solder positioning device may be applied adjacent the first side ofthe first insulative base along the top plane. Such a solder positioningdevice provides cavities positioned in alignment with apertures of thefirst insulative base. Typically, the first ends of the respectivecontacts are positioned adjacent to or within the respective cavities.Solder portions may be inserted into the cavities, thereby contactingthe first end of the contacts with the respective solder portions. Heatis applied, thereby fusing the solder portions with respective first endof the contacts. An electrical connector may be formed with at least onefused solder portion in the top plane.

In an alternate embodiment of the invention, an apparatus and a methodof making a connector using a solder carrier applied from beneath aninsulative base is employed. In this method, a first insulative base isprovided, the first insulative base having a lower side, an upper side,and at least one aperture extending from the lower side to the upperside. At least one contact is provided within an aperture, the contactextending from the lower side towards the upper side. The contactprovides a first end positioned near the lower side of the firstinsulative base. Next, it is possible to provide a solder carrieradjacent to and beneath the first insulative base, the solder carrierfacing the lower side of the first insulative base. The solder carriermay include notches on its upper surface. A solder portion may bedeposited into a notch, thereby forming a “loaded” notch. Then, the“loaded” notch may be placed in alignment with an aperture of the firstinsulative base, such that the first end of the contact is positionedwithin the loaded notch. At this point, heat may be applied to fuse thesolder portion to the first end of the contact, forming an electricalconnection unit having at least one fused contact.

BRIEF DESCRIPTION OF THE DRAWINGS

A full and enabling disclosure of this invention, including the bestmode shown to one of ordinary skill in the art, is set forth in thisspecification. The following Figures illustrate the invention:

FIG. 1 is a perspective view of a mated electrical connector array ofthe invention;

FIG. 1A shows a partially cut-away side view of the electrical connectorarray taken along lines 1A—1A of FIG. 1;

FIG. 1B shows a top view of the electrical connector array of FIG. 1;

FIG. 2 shows an exploded view of the electrical connector array restingin a mounting position between two circuit boards, with the firstconnection unit shown near the upper portion of FIG. 2 and the secondconnection unit in the lower portion of FIG. 2;

FIG. 2A shows a top view of an insulative body portion of the firstconnection unit, without contacts or solder portions;

FIG. 2B shows a bottom view of the insulative body shown in FIG. 2A;

FIG. 2C reveals a side view of the insulative body of FIGS. 2A-2B;

FIG. 3A shows a portion of a stamped carrier strip providing contacts instamped groups;

FIG. 3B shows overmolded contact set groups ready for detachment andinsertion into insulative bases;

FIG. 3C illustrates in perspective view a contact set group of FIG. 3Bwhich has been removed from the carrier strip;

FIG. 4A illustrates in perspective view insertion of a plurality ofovermolded contact set groups into a first insulative base;

FIG. 4B is a top view of an insulative base with contacts inserted intorespective apertures;

FIG. 4C is a cross-sectional view of the first insulative base withcontacts inserted, taken along lines 4C—4C seen in FIG. 4B;

FIG. 5 represents a cross-sectional view of the structure in FIG. 4B,shown along lines 5—5 of the insulative base with contacts inserted;

FIG. 6 is a combined modular unit showing two first connection unitsmated in a side-by-side relationship, with connectors and solderportions in each insulative base;

FIG. 7 is a cross-sectional view along lines 7—7 of FIG. 6 showing twoinsulative bodies interlocking at their respective sides, forming amodular unit as further shown in FIG. 6 and as described herein;

FIG. 8 illustrates yet another embodiment of the invention comprising amated nine-unit array;

FIG. 9 shows an exploded view of a solder positioning device preparedfor placement upon a first insulative base to position for fusion asolder ball array within cavities of the solder positioning device;

FIG. 10 shows the underside of the solder positioning device of FIG. 9:

FIG. 11 illustrates a close-up perspective view of a solder positioningdevice with solder portions inserted into cavities fitted upon the topplanar flat surface of a first insulative base;

FIG. 12 reveals a close-up top view of the solder positioning devicewith dotted lines showing the position of an insulative base beneath thesolder positioning device;

FIG. 13A is a partial cross-sectional view of the assembly of FIG. 12,with a solder positioning device overlying an insulative base, takenalong lines 13A—13A of FIG. 12, prior to fusion of solder portions withrespective contact elements;

FIG. 13B shows a partial cross-sectional view of the assembly of FIG.12, taken along lines 13B—13B shown in FIG. 12, after solder portionshave been heat fused to contacts;

FIG. 14 illustrates an alternate embodiment of the invention in which acontinuous solder positioning belt or loop having multiple cavity arraysis employed;

FIG. 15 illustrates an automated process for employing the solderpositioning belt of FIG. 14 to manufacture electrical connector units;

FIG. 16A shows an alternate method of constructing connection units ofthe invention in which a carrier is employed to position solder againstcontacts for heat fusion, in which solder portions are loaded intonotches of the carrier and applied to ends of contacts;

FIG. 16B illustrates displacement or removal of a carrier from aninsulative base after fusing solder portions to contacts;

FIG. 17 illustrates a continuous process that may be employed to applysolder portions to insulative bases, thereby forming loaded notches;

FIG. 18 illustrates one example of a first cantilever-type contact pairfrom a first connection unit being moved towards mating configurationwith a second cantilever-type contact held within a second connectionunit,

FIG. 19 shows the contacts of FIG. 18 wherein the contacts have achievedelectrical communication or union with each other, but are not fullymated;

FIG. 20 illustrates the opposed paired contacts of FIGS. 18-19 in whichthe contacts have been fully mated to each other;

FIG. 21A illustrates a perspective view of one configuration of acontact previously shown in FIG. 3C, which has been cropped, but withoutovermolding;

FIG. 21B shows another contact;

FIG. 21C illustrates yet another contact;

FIG. 22A is a top view of a retaining device that can be used toprecisely place a group of electrical connectors upon a circuit board;

FIG. 22B shows the reverse side of the retaining device shown in FIG.22A;

FIG. 22C is a partial section and side view of the retaining device ofFIGS. 22A-B;

FIG. 22D is a close-up view of a portion of the retaining device asshown in FIG. 22B, which features a rib employed for retaining theelectrical connector within the frame of the retaining device;

FIG. 22E is a perspective view of the retaining device or frame of FIG.22B;

FIG. 23 is an expanded view showing four electrical connectors as fittedinto the retaining device of FIG. 22B;

FIG. 24 illustrates a robotic arm precisely placing the assembly ofclaim 23 upon a circuit board;

FIG. 25 illustrates yet another embodiment of a retaining device; and

FIG. 26 depicts the retaining device shown in FIG. 25, with severalelectrical connectors inserted for retention and one electricalconnector shown in expanded view above the retaining device.

DETAILED DESCRIPTION OF THE INVENTION

Reference now will be made to the embodiments of the invention, one ormore examples of which are set forth below. Each example is provided byway of explanation of the invention, not as a limitation of theinvention. In fact, it will be apparent to those skilled in the art thatvarious modifications and variations can be made in this inventionwithout departing from the scope or spirit of the invention.

Turning to FIG. 1, a connector array 20 is shown comprising a firstinsulative base 21 positioned in mated configuration with a secondinsulative base 25. The first insulative base 21 includes numeroussolder portions, such as solder portions 22 a-b (also known as “solderballs” or “solder nubs”) on its first side 28 as shown in FIG. 1.Likewise, the second insulative base 25 contains a plurality of solderportions not shown in FIG. 1, which are located beneath the secondinsulative base 25 on the second side 29 (see FIG. 1A). Furthermore,both the first and second insulative bases 21, 25 contain a plurality ofcontacts such as elongated contact 30 a (see FIG. 1A section view), eachof which may be connected to a respective solder portion 22 a-b as inFIG. 1.

In FIG. 1A, elongated contacts 30 a, 30 b, and 41 b, for example, areunited with respective solder portions; that is, solder portion 22 a isfused to contact 41 b; solder portion 22 b is fused to contact 30 a; andcontact 30 b is fused to solder portion 22 c. The plurality of solderportions 22 a, 22 b on the first side 28 of the first insulative base 21are electrically connected to a plurality of elongated contacts on thesecond side 29 of the first insulative base 21. Walls 41 a and 35 areshown in FIG. 1A. These walls 41 a and 35 separate apertures 66 a-j insome applications, and in other locations serve to isolate the matedportion of contacts 30 a. (See also FIG. 4A).

Interlocking nubs 46 a-e are provided along edge 38, which will bediscussed further herein regarding the modular interlocking features ofthe invention. Interlocking nub 46 g is seen in FIG. 1 and FIGS. 1A, 1Bas well. The method of operation of these structures is furtherdiscussed herein. FIG. 1B shows the top view of features here described.Interlocking nub 46 f is seen along the right side of FIG. 1B.

Contact 30 a as illustrated in FIG. 1A includes a first end 31 fused tosolder portion 22 b, and a second end 32 for mating. Contact 30 bincludes on its first end 33 a solder portion 22 c, and its second end34 mates with second end 32 of contact 30 a.

In FIG. 2, an exploded view of connector array 20 is shown as a two-partassembly which includes first connection unit 26 and second connectionunit 27. The first and second connection units 26-27 are mated, and arepositioned between and fused electrically with first circuit board 23and second circuit board 24, respectively. When mated and applied tocircuit boards 23, 24 electrical communication between said circuitboards is effected by connector array 20. Other reference characters andstructures in FIG. 2 have been discussed in connection with FIGS. 1 and1A. Interlocking nubs 40 a and 40 b project from the second insulativebase 25 in the lower right portion of FIG. 2.

In the practice of the invention, first insulative base 21 is shown intop view in FIG. 2A, without any contacts or solder portions. Numerousparallel apertures are provided in first insulative base 21, includingapertures 66 a-j, each extending from a point near edge 38 to anopposite side of first insulative base 21 near interlocking nub 46 f. Atotal of ten apertures are seen in FIG. 2A. In other embodiments of theinvention, apertures may be of different number or shapes, such ascircular, oblong, oval, triangular, or rectangular. There is no limit tothe number of contacts that may be provided for insertion into a givenaperture 66 a. The invention may use apertures of any shape or geometry,and the invention is not limited to those shown and described herein.Apertures may be designed and sized to hold any number of contacts,which may be inserted singly or in contact groups.

A strut member 44 a and strut member 44 b are shown in FIG. 2A,extending vertically and thus stabilizing first insulative base 21.Registration notches 45 a-j register a group of contacts for insertioninto apertures 66 a-j, respectively. Notches 45 a-j are not required inthe invention, and some apertures might contain notches, while othersmay not require them, depending upon the desired contact configuration.Contacts may be registered in their proper location with a cam fit intoregistration nub 49 (see FIG. 3C) against registration notch 45 a when acontact group 55 a (see FIGS. 3C and 4A) is inserted into aperture 66 a.

Interlocking nubs 46 a-g are shown on the periphery of first insulativebase 21. Interlocking nubs 46 a-e are shown on the left side of firstinsulative base 41, while interlocking nubs 46 f is shown on the rightside of the first insulative base 21. Several of such interlocking nubs46 a-g also are seen in side view in FIG. 2C. The function of theinterlocking nubs 46 a-g is to lock together in “dovetail” fashion morethan one insulative base to form larger arrays, in a modular system, asfurther discussed below in connection with FIG. 7.

FIG. 2B shows the opposite side of first insulative base 21. In FIG. 2C,an end view of first insulative base 21 is shown.

FIG. 3A shows a carrier strip 50, illustrating one method and means formanufacturing or stamping contacts in the application of the invention.For example, a contact group 51 has been stamped out of the carrierstrip 50, forming a plurality of contacts 52 a-h extending from contactgroup 51. The carrier strip may be very long, and may be coiled forefficient storage until needed in manufacturing operations.

FIG. 3B shows yet another carrier strip 59 having an overmold 54extending along carrier strip 59, forming an overmolded contact group 55a along molding line 54. Thus, it is possible to employ in the inventioncontacts of many different varieties, including those which areovermolded, and those which are not overmolded.

An overmold may comprise generally any material that is capable ofproviding a durable and resilient fit into first insulative base 21.Overmolding may provide a tight and snug fit of an overmolded contactgroup 55 a into insulative base unit 21, increasing retention of thecontact group 55 a into insulative base 21. Overmolding assists inproviding contacts in registration and in precise and correct alignment,which may be beneficial. In some applications, overmolding serves toprevent undesirable wicking (running) of solder down contacts duringheating and reflow of solder portions upon contacts, as furtherdiscussed herein. Also, overmolding may serve to assist in electricallyisolating contacts from each other.

Overmolding materials may be comprised of liquid crystal polymer(“LCP”), thermoplastics, thermoset resins, or other polymeric materials.Several products can be employed, including but not limited to, forexample, Zenite®, manufactured by DuPont Corporation, and Vectra®,distributed by the Ticona Corporation.

One example of an overmolded contact group 55 a that may be employed inthe invention is seen in FIG. 3C. Polymer molding 56 extends to connectmultiple contacts 48 a-j as shown in FIG. 3C. A registration nub 49extends from polymer molding 56, the registration nub 49 being adaptedfor relatively precise registration of the overmolded contact group 55 awithin a first insulative base 21 as shown in FIG. 4A. A first end 57 ofcontact 48 j is shown in FIG. 3C, the first end 57 being the location atwhich a solder portion is provided in the manufacturing operation, asfurther discussed herein.

FIG. 4A shows a first insulative base 21 receiving overmolded contactgroups 55 a-j into respective apertures 66 a-j of the base. FIG. 4Bshows a top view of the first insulative base 21 with overmolded contactgroups 55 a-j inserted. Furthermore, contacts 62 and 65 are seen inFIGS. 4B-5, respectively. Interlocking nubs 46 a-g project from theperiphery of first insulative base 21 in FIG. 4B.

After contact groups 55 a-j, with or without overmold, are inserted intofirst insulative base 21 (see FIG. 4A), the contacts are cropped. Thatis, a mechanical punch or similar device (not illustrated) may shear anymetal portions remaining between individual contacts of contact groups55 a-j. This cropping process electrically isolates contacts from eachother. Cropping also in some instances may occur before the contacts areinserted into the insulated base, depending upon the particularmanufacturing sequence employed.

In FIG. 4C, a first end 63 of contact 62 is ready for mating with asolder portion or solder ball (not shown in FIGS. 4B-5). A second end 64of the contact 62 is adapted to form an electrical conductive pathwaywhen the connector is mated against an identical or mirror-imagecounterpart unit. The cross-section in FIG. 4C is taken along lines4C—4C, through the center of the contact group 55 g. FIG. 5 shows across-sectional view taken through contact 65. Furthermore, interlockingnubs 46 h, 46 j, and 46 g are seen on the respective sides of firstinsulative base 21.

FIG. 6 shows a 200-position connection unit 90 that is formed by unionof first insulative base 21 with a mirror image or interchangeableinsulative base 87. The connection unit 90 is formed by interlockingnubs 88 a-d, shown near the center of FIG. 6. FIG. 7 shows across-section taken along line 7—7 of FIG. 6, in which interlocking nub88 a and 88 d close upon interlocking nub 46 g to form a dovetail joint92. Thus, insulative base 87 is connected at its side with firstinsulative base 21 to form a larger, modular array. Interlocking may beaccomplished by sliding interlocking nub 46 g along and betweeninterlocking nubs 88 a-d, such that one corner is first formed into adovetail joint 92, and then interlocking nub 46 g slides in-betweeninterlocking nubs 86 a-d so that an entire side is formed into adovetail joint 92. Alternately, another means for interlocking isprovided by placing interlocking nub 46 g against interlocking nubs 88a-d along essentially the entire length of insulative bases 21 and 87.Then, first insulative base 21 may be forced against insulative base 87,so that interlocking nub 46 g is pressed or “snapped” along its lengthbetween interlocking nubs 88 a-d. This press fit or snap assembly may beparticularly effective when materials are used in forming firstinsulative base 21, insulative base 87, or both, that comprise flexiblepolymeric material that is capable of bending or deforming under force,and then resuming an original shape once force is removed, to formdovetail joint 92.

FIG. 8 shows a 900-contact array 101, in which nine insulative baseunits have been connected together, interlocked at respective sides, andmated with opposing units. There is no limit to the number of contactsthat may be provided in a given array, or in an expanded array. Eachconnection unit could be manufactured in a contact grid other than the10×10 contact grid 102 shown for each. For example, grids having thefollowing contact arrangements could be constructed: 4×4, 6×6, 8×8,12×12 or others. Also it would be possible to build grids which arerectangular as in 4×6, 6×12, and the like, without limitation. Numerouscombinations are available and could be applied.

FIGS. 9-17 illustrate various manufacturing techniques that may beemployed to construct connector arrays 20 of the invention. First, inFIG. 9, an exploded view of a solder positioning device 112 (sometimescalled a “stencil”) is shown. However, the invention is not limited tothat structure shown in FIGS. 9-10, and other means for bringing solderinto proximity of contacts can be employed within the scope and spiritof this invention. Solder positioning device 112 may be positioned upontop plane 110 of the first side 28 of first insulative base 21.Apertures on the top plane 110 of the first insulative base 21, areshown filled by overmolded contact groups such as 55 j. A bottom plane111 is shown in FIG. 9. Overmolded contact group 55 j is positioned nearthe middle of FIG. 10.

An array of cavities 113 are provided on the surface of solderpositioning device 112, extending through to the underside 117.Alignment slots 115 a-b assist in registration and positioning of thesolder positioning device 112, with respect to a first insulative base21. A solder portion array 116 (shown in exploded view) is depositedupon the upper surface 108 of the solder positioning device 112. Thesolder portion array 116 comprises numerous portions, balls, powder, orpastes of solder that fit into respective cavities 113.

FIG. 10 shows underside 117 of solder positioning device 112. Theunderside 117 provides alignment ledges 118 a-b. Alignment ledges 118a-b may be in any number or any arrangement, but in the specificembodiment shown in FIG. 10 there are two ledges which are spaced, andgenerally parallel to each other, on either side of the cavities 113.One or more alignment ledges 118 a-b may be placed at a specific andpredetermined distance from the cavities 113 so that alignment ledges118 a-b may be used to register cavities 113 exactly on top of and incommunication with the respective apertures 66 a-j (FIG. 2A) incommunication with contacts of the first insulative body 21.

FIG. 11 reveals a perspective close-up of solder positioning device 112positioned over the first insulative body 21 to form first connectionunit 26. Solder portions from solder portion array 116 enter cavities113 to form loaded cavities 121, seen also in FIG. 12. FIG. 12illustrates a top view of first connection unit 26, with solder portionarray 116 inserted into cavities 113, including specifically, solderportion 123 and solder portion 124, in the lower right portion of FIG.12. Furthermore, solder portion 135 and solder portion 136 are seen inFIG. 12.

FIG. 13A is a side partial sectional view along section lines 13A—13A(see FIG. 12) of first connection unit 26 of FIG. 10, as it appearsprior to heating and fusing the solder portion array 116. Solderportions 123-124 are shown in partial section view, as illustrativeexamples. In FIG. 13A, prior to heating, contact 125 includes a firstend 126 adjacent to solder portion 123, and a second end 127. Thecontact 128 is shown having first end 129 adjacent solder portion 124,and second end 130. Solder positioning device 112 holds solder portions123 and 124 in place for reflow to first end 126 and first end 129,respectively. Heat is applied as further described herein, totemperatures ranging from about 180° C. to about 260° C. or more,depending upon the characteristics of the specific solder employed.

In FIG. 13B, first connection unit 26 is shown after heating and reflowof fused solder portion 135 and fused solder portion 136 upon contact137 and contact 140, respectively. Contact 137 includes a first end 138fused with solder portion 135. Second end 139 is held erect for mating.Contact 140 contains a first end 141 fused to solder portion 136. Asecond end 142 of contact 140 is poised for mating.

FIG. 14 illustrates in perspective view one apparatus that can be usedfor high speed manufacturing processes. In such high speed or continuousprocesses, a solder positioning belt 144 may be used instead of solderpositioning device 112 for holding respective solder portions againsttheir respective contacts. Solder positioning belt 144 is fitted withcavity arrays 145, 146 and 147. There is no limit to the number ofcavity arrays 145-147 that can be provided upon solder positioning belt144. In this particular embodiment, three cavity arrays 145-147 areshown for illustrative purposes. Wheels 148 a-b are provided for turningand/or rotating solder positioning belt 144 in a continuous process.Solder positioning belt 144 may be applied as shown in FIG. 15, as oneexample.

Other applications could employ an intermittent belt, a carousel, or anytype of “bed” capable of holding and locating solder portions.

In FIG. 15, automated process 159 is shown. Electrical connection units154 a-f are shown in FIG. 15 proceeding from the left to the right sideof the Figure, in continuous fashion. Drive wheels 152 a-b rotateconveyor 153 in clockwise fashion. This motion moves electricalconnection unit's 154 a-f along the manufacturing line, in which solderis positioned and then heated for reflow upon contacts. Electricalconnection unit 154 a is shown receiving from solder dispenser 151 anarray 151 a of solder portions. Once the array 151 a is loaded, thenelectrical connection units proceed through heating oven 150, as shownfor example by electrical connection unit 154 c. While in the oven 150of the automated process 159 the solder arrays 151 a-f are respectivelyfused to contacts (contacts not visible in FIG. 13). A completedelectrical connection unit 154 f is shown advancing beyond the conveyor153. Solder positioning belt 144 rotates clockwise as shown in FIG. 15and in synchronous time with conveyor 153. Fresh cavity arrays (such ascavity array 145 of FIG. 14) are presented to mate with assembledelectrical connection units (such as electrical connection unit 154 a)at solder dispenser 151. In other applications, a solder paste may beapplied or wiped upon solder positioning belt 144, rather than usingparticles of solder as shown in FIG. 15. Thus, a solder paste can bewiped over cavity arrays 145-147, thereby “loading” the respectivecavities with solder paste. Furthermore, solder portions from solderarray 151 a in excess of that needed to fill up a given array onelectrical connection unit 154 a may drop into a solder collector 149,for later re-use.

FIG. 16A shows yet another embodiment of the invention, in which soldercarrier 172 may be employed to construct first connection unit 164 (seeFIG. 16B for completed first connection unit 164). FIGS. 16A-B showseveral views of a method and apparatus for using carrier 172 to joincontacts with respective portions of solder. In FIG. 16A, a firstinsulative base 165 is shown in a partial cross-section view, with anupper side 166 and a lower side 167. A plurality of apertures extendfrom the upper side 166 to the lower side 167 (apertures 163 a-b asexamples, are shown in FIGS. 16A-B). Walls 198-199 electrically isolatecontacts 178-179 and provide structural support to first connection unit164.

Below first insulative base 165 is solder carrier 172. Solder carrier172 may include numerous open notches on its upper surface, such as forexample notch 173 which contains solder portion 181, and notch 174 whichcontains solder portion 180 (when filled with a solder portion, they arereferred to herein as a “loaded notch”). It is possible to have anentire array of notches 173-174 in a grid, such as: 4×4 , 6×6, 8×8,10×10, 12×12, 6×10, 8×12, and the like.

FIG. 16A illustrates a heating position 177 in which a first contact 179and a second contact 178, for example, are in mating contact with solderportion 180 and solder portion 181, respectively. Once heat is appliedand solder is fused, carrier 172 may be removed from first connectionunit 164.

FIG. 16B shows a removal position. At the stage shown in FIG. 16B, theinsulative base 165 has been heated, and the solder portions 180-181have been fused to respective contacts 174-173. Now, the carrier 172 maybe removed from the first connection unit 164. Lower surface 167 offirst insulative base 165 is pulled away from carrier 172, as fusion ofthe various solder portions 180-181 (and others) has been completed.

FIG. 17 shows an alternate embodiment of a method and apparatus formanufacturing. Automated process 190 is employed to construct electricalconnection unit's 191 a-g using carrier templates 193 a-g as shown. Inthe continuous manufacturing process shown in FIG. 17, a solderpositioning carrier belt 192 may rotate (i.e.: clockwise in FIG. 17)around wheels 194 a-b. Furthermore, solder application area 195 providessolder upon first connection unit 191. The solder applied may be in theform of spherical balls, particles, granules, or even a spreadablesolder paste that is applied upon the upper surface of carrier templates193 a-g as the respective carrier templates 193 a-g move by solderapplication area 195. The process may form a plurality of “loaded”notches, which are then heated in oven 197. Various types of solder maybe employed in different consistencies or geometric arrangements, liquidor solid, to provide an efficient and effective means for installingsolder into carrier templates 193 a-g to form such loaded notches. Ofcourse, continuous processes could be employed using means or apparatusother than those shown in FIG. 17, and such processes also are withinthe scope and spirit of the invention.

FIG. 18 shows one embodiment of the invention in which contacts 30 a and30 b of FIG. 1A are isolated from connector array 20 to show theirconfiguration. Contacts 30 a-b, when mated, move together in a biasedpair to form an electrical conductive union.

Contact 30 a provides a first cantilever extension 251 opposite a secondcantilever extension 252 of contact 30 b. A first solder portion 22 b isconnected to the first end 31 of the first cantilever extension 251.Likewise, a second solder portion 22 c is connected to the first end 33of the second cantilever extension 252. An optional overmold 255, andovermold 256 also may be employed. The invention may be practicedwithout overmolding, as it is an optional feature. First cantileverextension 251 contains first bend 257, and a first curved portion 263lying generally between the first bend 257 and second bend 265. Beyondsecond bend 265 is a mating portion 267. The mating portion 267 extendsto the second end 32 of the first cantilever extension 251. Likewise,second cantilever extension 252 comprises a first bend 258, beyond whichlies a second cantilever extension 252. A second curved portion 264 liesbetween the first bend 258 and a second bend 256. Beyond the second bend256 lies a mating portion 268. A second end 34 of the second cantileverextension 252 is shown. The respective mating portions 117, 118 may begenerally straight, as shown in FIGS. 18-20, or in other applicationsmay be curved, depending upon the force defection required, and contactconfiguration of the particular connection system.

FIG. 19 shows contacts 30 a-b, in which the first cantilever extension251 and second cantilever extension 252 have been moved together, andare in resilient contact with each other as would occur when the firstinsulative base 21 and the second insulative base 25 (see FIG. 1A) arebrought together in a mating configuration to form connector array 20.FIG. 19 illustrates mating portion 267 and the respective matingportions 267, 268 being brought together, causing deflection of both thefirst cantilever extension 251 and second cantilever extension 252. Asshown in FIG. 19 first cantilever extension 251 is deflected towards theleft as shown in FIG. 19. The second cantilever extension 252 isdeflected towards the right, as shown in FIG. 19. Dotted lines showundeflected positions.

In FIG. 20, contacts 30 a-b are illustrated in a successive view inwhich the first cantilever extension 251 and second cantilever extension252 have been brought together in a full mating configuration, withoverlap 270 providing electrical conductivity between contact 30 a andcontact 30 b. In some cases it is preferable to have an overlap of atleast about 20% of the overall length of the first contact 30 a, butlesser or greater amounts of overlap can be employed, depending upon theparticular application.

FIG. 21A is a perspective view of one configuration of contact 48 a,previously illustrated as part of overmolded contact group 55 a in FIG.3C. In FIG. 21A, the contact 48 a is displayed without optionalovermolding, revealing the geometric shape of the metallic portion whichincludes aperture 301, first end 302 and second end 303. First bend 304and second bend 305 are illustrated as well.

FIG. 21B illustrates contact 48 b (without overmolding) which is part ofthe contact group 55 a previously seen in FIG. 3C. An aperture 306retains overmolding to contact 48 a (overmolding not shown). First end307 and second end 308 form the terminal portions of the contact 48 b,while first bend 309 and second bend 310 are illustrated. In otherapplications of the invention, more or less than two total bends percontact may be employed, depending upon the displacement requirementsand force required to maintain a resilient and satisfactory union.

FIG. 21C shows contact 48 j (previously seen in FIG. 3C). A first end 57is adapted for fusion with a solder ball or solder portion (not shown).Aperture 315 appears just beyond the first end 57. Second end 317 isseen as well. First bend 316 and second bend 318 also are illustrated.

FIGS. 21A-21C do not include overmolding upon the contacts, for clarityof illustration. Overmolding of contacts is an optional feature, and isnot always employed with contacts of the invention.

As it has become more important to produce smaller electricalcomponents, the tolerance of deflection of contacts within electricalcomponents is increasingly an important issue. That is, manufacturingtolerances sometimes require a deflection of a contact of between about0.020 inches and 0.030 inches, plus or minus 0.002 inches tolerance.This may be provided for components with only about 10% of displacementtravel from fully deflected to non-deflected. As engineeringrequirements demand smaller components, the travel distance ordeflection of a contact may be only about 0.002 inches, which is tentimes less deflection than 0.020 inches. Furthermore, if a stampingtolerance of +/−0.002 inches represents the entire amount of contacttravel that may be permitted, then use of the invention may beparticularly advantageous. One reason for this advantage in comparisonto other apparatus is that by employing the invention with opposedmating contacts, both of which are deflected, there may be a reductionin the total width required within the housing for deflection. Thisresults in the opportunity to manufacture smaller connector arrays 20.

There is no limit to the number of contacts that may be provided in agiven array, or in an expanded modular array. Each connection unit couldbe manufactured in a grid other than the 10×10 grid shown. For example,grids of the following could, as examples, be constructed: 4×4, 6×6,8×8, 12×12 or others. Also, it is possible to build grids which arerectangular as in 4×6, 6×12, and the like, without limitation. Numerouscombinations are available and could be employed.

Preferably, connector arrays 20 should be substantially co-planar. Thereare relatively strict tolerances for co-planarity. One factorinfluencing co-planarity of a substrate mounting face is the uniformityin size of solder portions (or solder balls) and the position of solderwith respect to the circuit board mounting face.

During manufacture, the “wicking” or running of melted solder along thelength of contacts may have undesirable consequences in part because itmay reduce the amount of the solder ball fusible body that is availablefor bonding upon a circuit board, and therefore may undesirably affectco-planarity of an array. Undesirable and unexpected reduction in thesolder ball mass may cause co-planarity problems.

In some applications the wicking of reflowed solder may be minimized bythe employment of overmolding upon the contacts. Overmolded portionsupon contact groups 55 a-j may be designed to fit tightly into a firstinsulative base 21, which may reduce the tendency of the solder totravel down the length of a contact upon reflow and melting of thesolder. In some applications, it is desirable to provide contacts forinsertion into the first insulative base in grouped stamped units, whichare not overmolded, but are held in place by other retention means knownin the art.

In the practice of the invention, various solder portions may be usedhaving a variety of different geometric shapes. However, one embodimentthat has proved effective is the use of spherical solder balls, such asthose made and distributed by the Indium Corporation of America, 1676Lincoln Avenue, Utica, N.Y. 13502. For example, spherical solder ballsare available in various alloys, including for example IndiumCorporation's part number 42141, which has an alloy comprising about 63%Sn (tin), and about 37% lead (Pb).

In other applications, the amount of Sn in the solder may be as high asabout 90%, or even greater. In some alloys, the remainder of the alloymay be lead. In other applications of the invention, a lead-free solderwhich is composed entirely of Sn could be employed. Furthermore, thereare other types of solder that may be employed in the practice of theinvention. In general, solder should possess a reflow temperaturesufficiently low to effect good bonding, but sufficiently high to avoidadversely affecting polymeric insulative body materials.

Solder alloys employed in the invention range between about 80% Pb and20% Sn; to a ratio of about 10% or less Pb and 90% Sn. One useful alloycomposition is about 63% Pb and about 37% Sn, with a melting point ofabout 183° C. A hard solder ball sometimes is seen to deform slightly asit softens under surface mount technique (SMT) conditions. Often, a softeutectic ball may be used for attachment of connectors to printedcircuit boards, and will usually reflow and reform itself under SMTconditions.

Other solder types that may be employed in the practice of the inventioninclude, without limitation, electronically acceptable tin-antimony,tin-silver, lead-silver alloys, and indium. In some cases, a solderpaste or cream may be incorporated or adapted for use in the invention.In some applications, a solder alloy may be employed in the form of afine powder suspended in a suitable fluxing material.

Heating is preferably conducted in a solder reflow conveyor oven asillustrated in FIGS. 15 and 17 or similar devices. Typically, the solderportion is heated to a temperature from about 181° C. to about 200° C.,but depending upon the identity of the material employed in the housing,solders have a melting temperature lower or higher than that specifiedherein may be used. Some solder alloys are heated to between 230° C. and260° C., depending upon the specific alloy used. Some solder requirestemperatures in excess of 260° C.

In automatic processes, a conveyor oven can be operated so that thetotal elapsed time of the alloy within an oven is between about 5 andabout 10 minutes, although some applications will use less or more timefor reflow. Sometimes, prior to being inserted into the conveyor oven,contacts and solder elements are preheated at an elevated temperature,to prepare then for fusion.

Several methods and apparatus are disclosed herein for retainingconnectors in position for soldering upon a circuit board or similarelectrical structure. In FIG. 22A, a retaining device 400 is shown intop view. The retaining device 400 comprises a frame 401 thatfacilitates placement of electrical connectors upon a circuit board, asfurther discussed below. The frame 401 includes first interior wall 402,second interior wall 403, third interior wall 404, and fourth interiorwall 405. The respective interior walls 402-405 are placed inperpendicular fashion as shown in FIG. 22A. The first interior wall 402and third interior wall 404 are shown in phantom, as they are underneaththe suction pad 406 shown in the center of FIG. 22A. The purpose andfunction of the suction pad 406 will be further discussed herein.

First exterior wall 407, second exterior wall 408, third exterior wall409, and fourth exterior wall 410 together form a four-sided structurethat bounds respective interior walls 402-405, forming frame 401. Therespective exterior walls 407-410 form an outer perimeter outside theframe 401, while the interior walls 402-405, in connection with theirrespective exterior walls 407-410, form four windows: 417 a, 417 b, 417c, and 417 d. Each of the respective windows 417 a-d is bounded by theinner perimeter of the frame 401. A center point 418 forms theintersection between the interior walls 402-405.

FIG. 22B shows the reverse side of retaining device 400 previously seenin FIG. 22A. In FIG. 22B, the reverse side of the suction pad 406 may beseen, where it connects to center point 418 near the center of FIG. 22B.

FIG. 22C shows a partial section side view of the device shown in FIG.22B. In FIG. 22C, the fourth interior wall 405 is shown in section viewat the top of the Figure, and the lower portion of FIG. 22C the window417 a is illustrated.

FIG. 22D is an expanded view of the portion shown by circle in FIG. 22B.FIG. 22D shows a close-up of one of the many ribs 420 a included alongthe inner perimeter of the frame 401. For clarity, the ribs are notnumbered in FIGS. 22A-C, but are shown in detail in FIG. 22E, describedbelow.

FIG. 22E shows a perspective view of the frame 401 of FIG. 22B. A tab421 extends underneath the center point 418. The tab 421 may serve as aholding mechanism to assist in retaining an electrical connector withinthe frame 401, as further discussed herein. Similar tabs to that shownas tab 421 may be provided in other windows 417 b, 417 c, and 417 a aswell. Tab 421 serves to retain an electrical connector within window 417d, as shown in FIG. 22E. However, it should be noted that tab 421 is anoptional feature of the holding mechanism of the frame 401, and it maywork in connection with a variety of other types of apparatus andmethods for holding an electrical connector in place, including but notlimited to the use of ribs, as further discussed below.

A plurality of ribs 420 a-m are provided along the inner perimeter ofthe windows 417 a-d of the frame 401. The ribs 420 a-m provide forresilient engagement against insulator or side portions of electricalconnectors when such electrical connectors are inserted into the windows417 a-d of the frame 401. The ribs 420 a-m act to hold the electricalconnectors in place, so that if the frame 401 is inverted for mountingupon a circuit board, as will be described below in connection with FIG.24, the electrical connectors will stay firmly in place within the frame401 to be heated and soldered to a circuit board, as further describedbelow. That is, ribs 420 a-m may be slightly deformed to facilitate thisholding function.

In the particular application shown in FIG. 22E, ledges 422 a-d areprovided to further stabilize an electrical connector squarely withinthe windows 417 a-d when the electrical connectors are placed withinsuch windows 417 a-d. The insulative base of electrical connectors maybe pressed firmly against the surface of ledges 422 a-d, so that theledges 422 a-d, in conjunction with tabs (such as tab 421) and the ribs420 a-m work together to form a holding mechanism that is capable ofsecurely retaining electrical connectors within the frame 401 until suchtime as the electrical connectors have been firmly soldered to a circuitboard or other electrical assembly. Furthermore, the ledges 422 a-d alsoserve to hold electrical connectors in position so that the array ofsolder balls presented to a circuit board assembly is planar, therebyproviding an even and consistent application of solder balls forsoldering.

FIG. 23 shows an expanded view including first electrical connector 426,which may be placed into window 417 a. Second electrical connector 427is configured for insertion into window 417 b. Third electricalconnector 428 likewise is configured for insertion into window 417 d,while fourth electrical connector 429 is configured for insertion intowindow 417 c of the frame 401.

Each of the respective windows 417 a-d includes at least one ribprojecting along the inner perimeter of the interconnected walls. Theribs 420 a-m that may be seen in FIG. 23 are adapted for resilientengagement against the respective electrical connectors, 426-429.

The frame 401 shown in FIG. 23 is adapted for holding four electricalconnectors 426-429. However, there is no limit to the number ofelectrical connectors that could be accommodated within a frame 401, andother embodiments that are within the spirit and scope of the inventioncould include a frame 401 which hold two, three, five, six, or moreelectrical connectors within a single frame 401.

In FIG. 23, the embodiment shown therein provides several ribs along theinner perimeter of respective windows 417 a-d. For example, window 417 dincludes two ribs upon the interior walls (i.e. first interior wall 402and second interior wall 403). However, the exterior walls 407-410 shownin the embodiment of FIG. 23 each include only one rib 420. However,other arrangements could be provided with more ribs upon exterior walls,or less ribs upon interior walls, but the arrangement shown in FIG. 23has proven satisfactory. The tab 421 is oriented generally perpendicularto the interior walls 402, 403 and is positioned to facilitate theretention of electrical connector 428 within the perimeter of walls 402,403, 408, and 407. It may be seen that each exterior wall 407-410provides a boundary for two windows, as shown in FIG. 23. For example,first exterior wall 407 forms a boundary for window 417 c and window 417d.

FIG. 24 illustrates one means of employing the retaining device 400 toprecisely move, place, and then facilitate attachment of electricalconnectors upon a circuit board 434. In FIG. 24, the retaining device400 has been inverted, and a robotic arm 435 picks up the retainingdevice 400 by means of a suction tip 437 which uses vacuum air force toattach in a reversible manner to suction pad 406 positioned near thecenter of the retaining device 400. Electrical connector 426, 427, 428,and 429 held within retaining device 400, in an inverted position,thereby making available solder balls for contact with circuit board434. Once the retaining device 400 with the electrical connectors426-428 attached is placed against circuit board 434, the assembly isheated to facilitate fusing solder balls to a trace on the circuit board434, thereby forming an integration of the electrical connectors 426-429with the circuit board 434, completing the circuit. Once cooling hasoccurred, then it is possible to simply remove or crop off the retainingdevice 400, leaving the electrical connectors 426-429 firmly secured tothe circuit board 434.

It is possible in other applications to manually place a retainingdevice 400 in position, or to use some other mechanical means of placingthe retaining device 400 upon circuit board 434, using means other thanthat shown in FIG. 24. Furthermore, a robotic arm 435 with a suction tip437 as shown in FIG. 24 also could be used for the placement of theretaining device shown in FIGS. 25-26.

Turning to FIG. 25, yet another embodiment of the invention, retainingdevice 500 is shown having a planar base 501 with a first side 507 (topside) and a second side 502 (opposite or bottom side). The planar base501 includes a first end 511 and a second end 512. At the first end 511,a first wall 503 is perpendicular to the planar base 501. A second wall504 is perpendicular to the planar base 501 as well. The embodimentshown in FIG. 25 contains only two walls and a planar base 501, but itwould be equally possible for one wall, three walls, four walls, or more(in the case of a multi-sided structure) to be provided upon a planarbase 501 in the practice of the invention. A retention mechanismcomprising resilient members 505 a-h is shown in FIG. 25. One or more ofthe resilient members 505 a-h may include an elongated body, with theelongated body having a first end and a second end, the first end beingaffixed to planar base 501 and the second end having a hooked portion.The hooked portion may be oriented for bearing against and restrainingelectrical connectors against the planar base 501, as will be furtherdescribed herein with respect to FIG. 26.

The second side 502 (i.e.: bottom side as seen in FIG. 25) of the planarbase 501 may receive a suction force that facilitates movement andplacement of the retaining device 500, similar to that shown in FIG. 24.The retaining device 500 may include a mid-line 506 along its center,with opposing resilient members 505 a-h in a paired configuration. Forexample, resilient member 505 e is opposed and paired with resilientmember 505 g, to secure electrical connector 510 d from two sides asfurther shown in FIG. 26. Similar pairings of resilient members 505 a-hinclude the following pairs: (1) 505 a/505 f, (2) 505 b/505 c, (3) 505d/505 h. In other applications of the invention, it would be possible tohave more or less resilient members 505 a-h to hold each respectiveelectrical connector 510 a-d. However, the particular embodiment shownin FIG. 5 employs two paired resilient members for each electricalconnector 510 a-d.

In FIG. 26, electrical connectors 510 a-d are shown in position, inwhich they are being retained or held against planar base 501, accordingto the practice of the embodiment of the invention shown in FIG. 25.Furthermore, it would be possible for only one, two, three, five, six,or more electrical connectors 510 a-d to be held by retaining device 500in the practice of the invention. Furthermore, other arrangements ofresilient members 505 a-h could be employed to perform the same orsimilar retaining function as shown in FIG. 26. In general, theresilient members 505 a-h may form opposed pairings in which they acttogether to apply retention forces upon electrical connectors 510 a-d.The opposed resilient members 505 a-h may comprise first memberspositioned adjacent the first end 511 of the planar base 501, and secondmembers positioned adjacent the second end 512 of the planar base 501.Furthermore, third members may be positioned along the mid-line 506, inwhich the retaining device 500 is configured to hold one or moreelectrical connectors 510 a-d.

It is understood by one of ordinary skill in the art that the presentdiscussion is a description of exemplary embodiments only, and is notintended as limiting the broader aspects of the present invention, whichbroader aspects are embodied in the exemplary constructions.

1. A method for manufacturing an electrical connection unit, the methodcomprising: (a) providing a first insulative base and a first set ofcontacts, said first insulative base having: i) a first side located ina top plane, ii) a second side opposite the first side, and iii) aplurality of apertures extending between said first side and said secondside; (b) inserting said first set of contacts into respective aperturesof said first insulative base, said contacts each having a first end anda second end, said first end being positioned near the top plane of saidfirst side; (c) applying a solder positioning device adjacent said firstside of said first insulative base in the top plane, said solderpositioning device providing a plurality of cavities positioned inalignment with respective apertures of said first insulative base,wherein said first ends of said first set of contacts are positionedadjacent to cavities within said solder positioning device; (d)inserting solder portions into said cavities, thereby contacting saidrespective first ends of said first set of contacts with solderportions; (e) heating said solder portions, thereby fusing said solderportions with respective first ends of said first set of contacts; and(f) forming a first electrical connection unit comprising an array offused solder portions in said top plane.
 2. The method of claim 1,comprising the additional steps of: (g) providing a second electricalconnection unit having a first side and a second side, whereby saidsecond connection unit is interchangeable with said first connectionunit, and (h) mating said second side of said electrical connection unitwith said second side of said first connection unit to form anelectrical connector array.
 3. The method of claim 1, wherein saidproviding step (a) employs at least one overmolded contact.
 4. Themethod of claim 3 in which said overmolded contact comprises a polymericmaterial.
 5. The method of claim 1 wherein said inserting step (d)comprises wiping a paste upon said solder positioning device.
 6. Themethod of claim 1 wherein said inserting step (d) comprises droppingsolder portions into said cavities.
 7. The method of claim 1 whereinsaid solder positioning device comprises a ceramic material.
 8. Themethod of claim 1 wherein said solder positioning device comprises acontinuous belt.
 9. The method of claim 6 wherein said solder portioncomprises a powder.
 10. The method of claim 1 wherein said heating step(e) is performed at a temperature of at least about 181 degrees C. 11.The method of claim 10 wherein said solder portion comprises at leastabout 50% Sn (tin).
 12. The method of claim 1 wherein said firstinsulative base is substantially flat in said top plane.
 13. The methodof claim 12 wherein said solder portions collectively comprise a solderball array, said solder balls projecting above the top plane of saidfirst insulative base.
 14. A method of manufacturing an electricalconnection array, the method comprising: (a) providing a firstinsulative base, said first insulative base comprising: i) a first sidelocated in a top plane; ii) a second side opposite said first side; iii)an edge comprising interlocking nubs; iii) an aperture extending fromsaid first side to said second side, and iv) a contact extending withinsaid aperture from said first side to said second side, said contactcomprising a first end positioned adjacent said first side of saidinsulative base in the top plane; (b) applying a solder positioningmeans upon said first side of said first insulative base in said topplane, said solder positioning means comprising a cavity in alignmentwith said aperture of said first insulative base, whereby said first endof said contact is positioned adjacent to or within said cavity; (c)inserting into said cavity a solder portion; (d) contacting said firstend of said contact with said solder portion; (e) heating said solderportion; (f) fusing said solder portion to said first end of saidcontact; and (g) forming an electrical connection unit having a fusedsolder portion in said top plane.
 15. The method of claim 14 whereinsaid providing step (a) additionally comprises the steps of providing asecond insulative base having interlocking nubs along an edge, andcombining said first and said second insulative bases to form a modulararray.
 16. The method of claim 14 wherein said solder positioning meanscomprises a first surface and a second surface, an alignment ledge beingprovided on said second surface, the second surface being applied incontact with said first insulative base, further wherein alignment ofsaid solder positioning means in step (b) is facilitated by employmentof an alignment ledge on the second surface of said solder positioningmeans.
 17. The method of claim 14, additionally comprising the step of:(h) removing said solder positioning means from said first insulativebase; and (i) repeating steps (a)-(g) for successive insulative bases ina continuous manufacturing operation.
 18. A method of manufacturing aconnector, the method comprising: (a) providing a first insulative base,the first insulative base having: i) a lower side, ii) an upper side,and iii) an aperture extending from the lower side to the upper side,and iv) a contact within said aperture, said contact extending from saidlower side to said upper side, said contact having a first endpositioned near the lower side of said first insulative base; (b)providing a solder carrier, said solder carrier having a notch on itsupper surface, (c) depositing a solder portion into said notch, therebyforming a loaded notch; (d) placing said loaded notch in alignment withsaid aperture of said first insulative base, such that said first end ofsaid contact is positioned adjacent to or within said loaded notch; (e)heating said solder portion; (f) fusing said solder portion to saidfirst end of said contact; and (g) forming an electrical connection unithaving a fused solder portion.
 19. The method of claim 18 wherein saidsolder portion comprises a solder paste.
 20. The method of claim 18wherein said solder portion comprises a solder ball.
 21. The method ofclaim 18, additionally comprising the additional steps of: (h) removingsaid solder carrier from said lower surface of said first insulativebase; and (i) repeating steps (a)-(h) for successive insulative bases byemploying successive solder portions, thereby providing a continuousmanufacturing operation.
 22. The method of claim 21 in which said soldercarrier comprises a solder positioning carrier belt, wherein the step(i) comprises in part rotating successive insulative bases upon saidsolder positioning carrier belt, thereby fusing said successive solderportions.
 23. The method of claim 22 wherein said solder positioningcarrier belt advances said successive insulative bases through an oven.24. The method of claim 18 wherein said solder carrier comprises a hightemperature resistant material.
 25. The method of claim 24 wherein saidsolder carrier comprises a polymeric material.
 26. The method of claim18 wherein said heating step is performed at a temperature of at leastabout 181° C.